New offers - Electronics 35

Inline thermal cure (TC) infrared and convection drying oven Operational condition

Offer title: TAGARNO XPRO Advanced Digital Inspection System Manufacturer: TAGARNO Model: XPRO Technical condition: as-is, where-is Category: Measuring instruments / Measuring Microscopes Description: High-precision digital inspection system for inspecting precision equipment, with a desktop table

DIMA MP100 Pick & Place, HP-2200 Tray Sequencer, feeder storage rack, 65 feeders, DIMA stencil printers and an ERSA re ow oven. A QUAD VMP20B stencil printer requires maintenance.

DIMA MP-200 + Go29 Stencil Printer + DIMA Solano RO 500 + Feeders

Teradyne GR2284i, ICT tester Additional information based upon request including photos.

Vapor phase oven Sold AS IS. Was taken from a working facility, but not tested.

Manufacturer: HELLER INDUSTRIES Model: 1700EXL Equipment type: Reflow soldering oven (SMT) Configuration: Left-to-right Condition: Used Operational status: Working Year of manufacture: 1999 Shipping: Available at buyer's expense

Semi-automatic three-chamber SMD stencil cleaning system Daunquart Max. stencil size 740 x 740 mm

2019 ASM Assembly Systems E by DEK Series 710 Automatic SMT Stencil / Solder Paste Printer, Model E by DEK, Series 710, S/N 853282, Mfg. 2019. High-precision automated printing system designed for SMT electronics manufacturing and precision solder paste deposition onto printed circuit boards. Features automated vision alignment, programmable motorized squeegee control, adjustable stencil mounting, programmable board handling and automated understencil cleaning. E by DEK platform provides system alignment capability of >2.0 Cmk @ ±25 µm (±6 sigma) with optimum core cycle time of approximately 8 seconds. Capable of processing substrates from approximately 50 x 40.5 mm up to 620 x 508.5 mm, substrate thickness from 0.2–6 mm, and stencil frames adjustable up to approximately 736 mm (29"). Equipped with integrated operator control/display, vision/camera system, conveyor/board handling system, squeegee assembly and programmable wet/dry/vacuum understencil cleaning system. Machine nameplate specifications: 115 VAC, 20 A, 50/60 Hz, single phase; compressed air requirement 5–8 bar. Includes accessories and components as photographed. HIT# 2538238. Loc: 1H. Asset Located at 26545 Danti Ct. Hayward, CA 94545.

FUJI NXT III M6 is a high-performance modular SMT Pick and Place Machine designed for high-mix and high-volume PCB assembly production. The M6 III module provides 45 feeder slots based on 8 mm tape feeders and supports a wide range of component placement heads, including H24, V12, H12HS, H08M, H02F and DX heads. The machine is designed for high-speed and high-precision placement, supporting components ranging from very small chip components to larger and odd-form components, depending on the selected placement head. Key Features: Manufacturer: FUJI Model: NXT III M6 Equipment Type: SMT Pick and Place Machine Module: M6 III Feeder Capacity: 45 slots High-speed and high-precision placement Modular machine architecture Single or dual conveyor configuration Supports tape feeders, stick feeders and tray units Suitable for high-mix and high-volume production Compatible with multiple placement head configurations Technical Specifications: Maximum PCB Size, Single Conveyor: Up to 610 × 610 mm Maximum PCB Size, Double Conveyor / Single Conveyance: Up to 610 × 510 mm Maximum PCB Size, Double Conveyor / Dual Conveyance: Up to 610 × 280 mm Feeder Slots: 45 Power Supply: 3-phase 200–230 V ±10%, 50/60 Hz Air Supply: 0.5 MPa (ANR) Machine Width: Approx. 645 mm per M6 III …

The Koh Young KY8030-3 is a high-speed True 3D Solder Paste Inspection (SPI) system designed for precise and reliable inspection of solder paste printing in SMT and PCB assembly production. The system uses Koh Young's patented 3D dual-projection technology to minimize shadow and reflection problems and provide accurate, repeatable measurement data. Its Z-tracking 3D compensation technology also compensates for PCB warpage to improve inspection reliability. The KY8030-3 is suitable for high-volume electronics manufacturing and can inspect solder paste volume, height, area, offset, bridging and other printing defects. Key Features: Manufacturer: Koh Young Model: KY8030-3 Equipment Type: True 3D Solder Paste Inspection (SPI) Application: SMT / PCB Assembly 3D Measurement Technology Dual-direction projection Active PCB Warp Compensation Automatic Conveyor Width Adjustment 01005 component inspection capability SPC Plus process control Gerber and ODB++ data support ePM-SPI programming software Windows operating system Inspection Capabilities: Insufficient solder paste Excessive solder paste Missing solder paste Solder paste offset Solder bridging Shape deformation Coplanarity Solder paste volume, area and height measurement PCB warpage compensation Condition: Used / Good Working Condition The machine can be inspected and tested before shipment. Photos, videos, technical specifications and quotation are available upon request. Please contact us for price, availability and …