New offers - Electronics 35

MAN B&W L28/32H we have 3 sets available, fully serviced and in like-new condition, available either as a complete package or individually.

3 sets, fully serviced and ready for sale

FUJI NXT III M6 is a high-performance modular SMT Pick and Place Machine designed for high-mix and high-volume PCB assembly production. The M6 III module provides 45 feeder slots based on 8 mm tape feeders and supports a wide range of component placement heads, including H24, V12, H12HS, H08M, H02F and DX heads. The machine is designed for high-speed and high-precision placement, supporting components ranging from very small chip components to larger and odd-form components, depending on the selected placement head. Key Features: Manufacturer: FUJI Model: NXT III M6 Equipment Type: SMT Pick and Place Machine Module: M6 III Feeder Capacity: 45 slots High-speed and high-precision placement Modular machine architecture Single or dual conveyor configuration Supports tape feeders, stick feeders and tray units Suitable for high-mix and high-volume production Compatible with multiple placement head configurations Technical Specifications: Maximum PCB Size, Single Conveyor: Up to 610 × 610 mm Maximum PCB Size, Double Conveyor / Single Conveyance: Up to 610 × 510 mm Maximum PCB Size, Double Conveyor / Dual Conveyance: Up to 610 × 280 mm Feeder Slots: 45 Power Supply: 3-phase 200–230 V ±10%, 50/60 Hz Air Supply: 0.5 MPa (ANR) Machine Width: Approx. 645 mm per M6 III …

The Koh Young KY8030-3 is a high-speed True 3D Solder Paste Inspection (SPI) system designed for precise and reliable inspection of solder paste printing in SMT and PCB assembly production. The system uses Koh Young's patented 3D dual-projection technology to minimize shadow and reflection problems and provide accurate, repeatable measurement data. Its Z-tracking 3D compensation technology also compensates for PCB warpage to improve inspection reliability. The KY8030-3 is suitable for high-volume electronics manufacturing and can inspect solder paste volume, height, area, offset, bridging and other printing defects. Key Features: Manufacturer: Koh Young Model: KY8030-3 Equipment Type: True 3D Solder Paste Inspection (SPI) Application: SMT / PCB Assembly 3D Measurement Technology Dual-direction projection Active PCB Warp Compensation Automatic Conveyor Width Adjustment 01005 component inspection capability SPC Plus process control Gerber and ODB++ data support ePM-SPI programming software Windows operating system Inspection Capabilities: Insufficient solder paste Excessive solder paste Missing solder paste Solder paste offset Solder bridging Shape deformation Coplanarity Solder paste volume, area and height measurement PCB warpage compensation Condition: Used / Good Working Condition The machine can be inspected and tested before shipment. Photos, videos, technical specifications and quotation are available upon request. Please contact us for price, availability and …

SAKI BF Planet X Operational condition unit Year: 2011

Vapor phase oven Sold AS IS. Was taken from a working facility, but not tested.

Agilen 5DX Series 3 Condition not tested, was taken from a working facility. Year: 2000

The ASYS ABA04 is an automatic industrial labeling system designed by the ASYS Group for the precise application of labels on printed circuit boards (PCBs) within electronic manufacturing lines. Main Features X/Y Axes: Servo-controlled movement. Head: 360-degree rotation. Printer: Integrated thermal transfer. Control: PC-based with Windows. Technical Data Conveyor width: Maximum 460 mm. Conveyor height: 850 mm (±50 mm). Flow direction: Left to right. Interfaces: Compatible with SMEMA, Siemens, and other standards. Automatic Label Applicator Labeler consisting of a servodriven X/Y-axle system, a rotating application head, a label printer and a conveyor. C-controlled unit Windows user guidance from left to right Manufacturer: ASYS Construction year: 2010

A complete, nearly new SMT and THT electronics production line. The equipment has been in operation for only about 150 working hours and is covered by a valid warranty with full service support. The offer includes the entire machine park, a laboratory, and additional equipment, allowing the buyer to immediately start their own electronics production. The line consists of: Hanwha SM482 Plus Pick&Place A high-speed SMT placement machine with 6 heads, designed for the precise placement of SMD electronic components. Supports PCBs up to 550 × 400 mm High performance and reliability—the heart of a modern production line ESE US-2000XQ solder paste printer with SPI inspection Integrated solder paste printer with inspection, controlling the amount and placement of solder paste. Ensures process repeatability Reduces the risk of defects and rework as early as the printing stage Nordson Asymtek Excelsius Type Four Oven XRC-6 Conveyor Oven A professional reflow soldering oven with nitrogen purging. Stable and repeatable thermal profiles High-quality solder joints even in demanding projects Nordson Select Novo 300S Selective Soldering Machine A modern solution for spot soldering of through-hole (THT) components. Precise tin dispensing Ideal for hybrid SMT + THT production 2D AOI System – CyberOptics QX150i A high-speed …

2019 ASM Assembly Systems E by DEK Series 710 Automatic SMT Stencil / Solder Paste Printer, Model E by DEK, Series 710, S/N 853282, Mfg. 2019. High-precision automated printing system designed for SMT electronics manufacturing and precision solder paste deposition onto printed circuit boards. Features automated vision alignment, programmable motorized squeegee control, adjustable stencil mounting, programmable board handling and automated understencil cleaning. E by DEK platform provides system alignment capability of >2.0 Cmk @ ±25 µm (±6 sigma) with optimum core cycle time of approximately 8 seconds. Capable of processing substrates from approximately 50 x 40.5 mm up to 620 x 508.5 mm, substrate thickness from 0.2–6 mm, and stencil frames adjustable up to approximately 736 mm (29"). Equipped with integrated operator control/display, vision/camera system, conveyor/board handling system, squeegee assembly and programmable wet/dry/vacuum understencil cleaning system. Machine nameplate specifications: 115 VAC, 20 A, 50/60 Hz, single phase; compressed air requirement 5–8 bar. Includes accessories and components as photographed. HIT# 2538238. Loc: 1H. Asset Located at 26545 Danti Ct. Hayward, CA 94545.

Manufacturer: Daikin Model: RXYSQ12TMY1B Type: VRV IV-S heat pump outdoor unit Nominal cooling capacity: 33.5 kW Nominal heating capacity: 33.5 kW Refrigerant: R410A Power supply: 380–415 V, 3N~, 50 Hz Condition: NEW / never installed State: Packed Packaging: Original Daikin factory packaging Year of manufacture: 2020 Quantity available: 3 units Dimensions (L x W x H): 575.0 mm x 1015.0 mm x 1745.0 mm Weight: 196.0 kg Notes: Never installed and stored on original pallets in the original Daikin packaging Special package pricing: available for purchases of 2 or all 3 units Delivery: Collection is possible; EU-wide freight can be arranged at the buyer's expense Additional information: Additional photographs and technical information available upon request

VISCOM AOI (Automatic Optical Inspection) S 3088 FLEX - vintage 2013 - very clean condition (see pictures) Technical Specifications: Camera Technology: - Orthogonal camera module 8M (4x megapixel cameras) - Angular view camera module 8M (4x megapixel cameras) - Included Components: PC and monitor included - Operating System: Windows 7 - PCB Handling & Transport: Automatic loading and unloading of circuit boards - Conveyor Direction: Left to Right - Fixing Rail: Front rail fixed - Power Requirement: AC 400V, 3-Phase - Working condition

Manufacturer: Universal Instruments Model: GSM Year of manufacture: 1999 Technical condition: For parts Weight: 3000 kg Quantity: 2 units Configuration: Twin-beam system with one 7-spindle head per beam Cameras: Standard cameras on both sides Documentation: Full paperback manuals Included accessories: Box with used spares and upgrades Current issues: Both units do not finalize initialization; suspected VME memory issue; units behave differently Operational history: Both ran OK before the issue occurred Intended use: Suitable for parts or repair Additional notes: Package sale of two machines